Doi Laboratory

CJUMP 2016
Changsha City, China, during November 4-6, 2016.  

Keynote Speech タイトル
Development of a Smart-Processing for Hard-to-Machine Substrates -An innovative "Dilatancypad" and a high-speed pressure with with bowl feed method polishing machine-

集合写真(拡大→ここをクリック)

ちょっと写真を加工(拡大→ここをクリック)。土肥先生はどこ?